1. 2. 3. material content data sheet sales product name ipp100n04s3-03 issued 29. august 2013 ma# MA000362834 package pg-to220-3-1 weight* 2038.89 mg construction element material group substances cas# if applicable weight [mg] average mass [%] sum [%] average mass [ppm] sum [ppm] chip inorganic material silicon 7440-21-3 8.313 0.41 0.41 4077 4077 leadframe non noble metal iron 7439-89-6 0.816 0.04 400 inorganic material phosphorus 7723-14-0 0.245 0.01 120 non noble metal copper 7440-50-8 815.335 39.98 40.03 399891 400412 wire non noble metal aluminium 7429-90-5 10.526 0.52 0.52 5163 5163 encapsulation organic material carbon black 1333-86-4 8.790 0.43 4311 plastics epoxy resin - 96.685 4.74 47421 inorganic material silicondioxide 60676-86-0 480.495 23.57 28.74 235666 287398 leadfinish non noble metal tin 7440-31-5 21.462 1.05 1.05 10527 10527 plating non noble metal nickel 7440-02-0 0.244 0.01 120 inorganic material phosphorus 7723-14-0 0.001 0.00 0.01 1 120 solder noble metal silver 7440-22-4 0.144 0.01 70 non noble metal tin 7440-31-5 0.115 0.01 56 non noble metal lead 7439-92-1 5.483 0.27 0.29 2689 2815 heatspreader inorganic material phosphorus 7723-14-0 0.177 0.01 87 non noble metal iron 7439-89-6 0.590 0.03 289 non noble metal copper 7440-50-8 589.466 28.91 28.95 289112 289488 *deviation < 10% sum in total: 100,00 1000000 important remarks: infineon technologies ag provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. infineon technologies ag and infineon technologies ag suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. all statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. company infineon technologies ag address 81726 mnchen internet www.infineon.com
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